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H Selective Soldering System

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H Selective Soldering System


ModelHPS4/35 /HPS4/61HPS4/35S
Equipment parameterDimension(L*W*H)2450*1845*1571mm/2900*2045*1571mm2450*2055*1571mm
Transport parameterTransport width adjustment50-460mm/50-610mm50-350mm
PCB size510*460mm/610*610mm510*350mm
Conveyor height900±20(mm)
Soldering systemSolder potElectromagnetic pump solder pot
N2 consumption1.5-2m³/h/potx1
Solder pot numbersSingle track single pot/double potsDual tracks dual pots
Module numbersOne/Two/Three modules


Single Pot Dual Pots Dual Pots Individual Control


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